A dual mode headphone has a band positioning the dual mode headphone on one of a head or neck of a user. A pair of first housings is provided wherein one of the first housings is formed on each end of the band. A dual mode headphone circuit is provided and has a dual-output acoustic transducer module positioned in each of the pair of first housings. The dual-output acoustic transducer module allowing for both air conduction and bone conduction of sound waves.