Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masaya Seki0
Manao Hoshina0
Date of Patent
December 4, 2018
0Patent Application Number
151181840
Date Filed
February 12, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.
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