Patent attributes
Various structures of a semiconductor package assembly are provided. In one implementation, a semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer disposed on the die-attach surface, surrounding the semiconductor die. Further, a first conductive bump disposed over the first solder mask, coupled to a first pad of the redistribution layer (RDL) structure through a single circuit structure on a portion the first solder mask layer, wherein a first distance between a center of the first pad and a sidewall of the semiconductor die, which is close to the first pad, is equal to or greater than a second distance between a center of the first conductive bump and the sidewall of the semiconductor die.
