US Patent 10150902 Thermally conductive silicone composition and electrical/electronic apparatus
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Patent abstract
Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member.
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Patent Inventor Names
Harumi Kodama0
Masayuki Onishi0
Tomoko Kato0
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US Patent 10150902 Thermally conductive silicone composition and electrical/electronic apparatus
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Patent jurisdiction
Patent number
10150902
Date of patent
December 11, 2018
Patent application number
15302555
Date Filed
March 26, 2015
Patent primary examiner
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