Patent attributes
A heat dissipating device including a base including a heat absorbing plate made of a metallic material and configured for an electronic product to be placed thereon; a heat absorbing plate flow channel is disposed within the heat absorbing plate and is configured for a cooling medium to flow through; a heat dissipating main body connected to the base; wherein the heat dissipating main body includes a housing, and a first heat dissipator and a heat dissipating fan disposed within the housing; the first heat dissipator includes a first heat dissipating substrate; a first heat dissipating flow channel, configured for the cooling medium to flow through, is disposed within the first heat dissipating substrate; the heat absorbing plate flow channel and the first heat dissipating flow channel are connected via pipes and form a cooling medium circulation loop; and a fluid pump is disposed in the cooling medium circulation loop.
