US Patent 10153234 System in package

An electronic system without using solder balls between electrical components, and without using interposer between chips and package substrate, without using a discrete system board for the chip package to mount. At least one chip is wrapped by molding material, a first redistribution circuitry is built on a bottom side of the molding material. A plurality of first inverse T-shaped metals of the first redistribution circuitry are electrically coupled to the at least one chip; a second redistribution circuitry is built on a bottom side of the first redistribution circuitry. A plurality of second inverse T-shaped metals of the second redistribution circuitry are electrically coupled to the first redistribution circuitry. Either the first redistribution circuitry or the second redistribution circuitry has at least a first extension extended beyond a corresponding side surface of the molding material to electrically couple to at least one device.