Patent attributes
A silicone gel composition for use in sealing or filling of electrical or electronic parts comprising at least one adhesion promoter (Z), and by curing to form a silicone gel having, at 25° C. and a shear frequency of 0.1 Hz, a loss elastic modulus of from 5.0×103 to 1.0×105 dyne/cm2, a complex elastic modulus of from 5.0×104 to 1.0×106 dyne/cm2, and a loss tangent of 0.3 or less. The silicone gel composition is provided, which can suppress the occurrence of air bubbles or cracks in silicone gel that seals or fills an electrical or electronic part and has excellent bonding to the electrical or electronic part even when used under high-temperature conditions as in a power device; and a silicone gel is provided, which can suppress the occurrence of air bubbles or cracks when it seals or fills an electrical or electronic part.
