Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 18, 2018
Patent Application Number
15624648
Date Filed
June 15, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods for depositing desired materials formed on different locations of a substrate with different materials using a selective deposition process for semiconductor applications are provided. In one embodiment, a method of forming a structure with desired materials on a substrate includes disposing organic materials on a surface of a substrate, performing a thermal treatment process to form polymer brush materials from the organic materials selective on a first region of the substrate, and selectively forming a material layer on a second region of the substrate uncovered by the polymer brush materials.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
