Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Taeje Cho0
Un-Byoung Kang0
Chungsun Lee0
Joonsik Sohn0
Jung-Seok Ahn0
Date of Patent
December 18, 2018
0Patent Application Number
151124290
Date Filed
March 19, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Provided are methods of fabricating a semiconductor device. According to the method, a first glue layer, a first release layer, a second glue layer, and a second release layer may be sequentially interposed between a carrier and a device wafer. All of the first glue layer, the first release layer, the second glue layer, and the second release layer may be formed of thermosetting resin.
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