Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chin-Shan Wang0
Shun-Yi Lee0
Date of Patent
December 18, 2018
0Patent Application Number
152553500
Date Filed
September 2, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of fabricating a semiconductor structure. The method includes forming a dummy structure over a semiconductor body. The method further includes depositing an inter-layer dielectric (ILD) over the semiconductor body. The method further includes removing a dummy material of the dummy structure to form an opening in the ILD. The method further includes filling the opening with a dielectric material to form a dielectric structure. The method further includes stacking a plurality of interconnect elements over the dielectric structure.
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