Patent attributes
An integrated fan-out package including an integrated circuit component, an insulating encapsulation, a redistribution circuit structure and a plurality of conductive terminals is provided. The insulating encapsulation laterally encapsulates sidewalls of the integrated circuit component. The redistribution circuit structure is disposed on the insulating encapsulation and the integrated circuit component. The redistribution circuit structure is electrically connected to the integrated circuit component and the redistribution circuit structure includes a plurality of ball pads. Each of the conductive terminals includes a conductive ball and a ring-shaped flux structure, wherein each of the conductive balls is disposed on and electrically connected to one of the ball pads. Each of the ring-shaped flux structures is disposed on the redistribution circuit structure. Each of the ring-shaped flux structure is disposed around and in contact with a bottom portion of the conductive ball. A method of fabricating an integrated fan-out package is also provided.
