Patent attributes
A method for forming a micro-electro mechanical system (MEMS) device is provided. The method includes bonding a semiconductor substrate with a carrier substrate through a dielectric layer and patterning the semiconductor substrate into multiple elements. The method also includes partially removing the dielectric layer to release some of the elements such that the released elements become one (or more) first movable element and one (or more) second movable element. The method further includes bonding a cap substrate with the semiconductor substrate to form a first closed chamber containing the first movable element and a second closed chamber containing the second movable element. In addition, the method includes opening the second closed chamber and sealing the second closed chamber after vacuumizing the second closed chamber such that the second closed chamber has a reduced pressure smaller than that of the first closed chamber.