Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsing-Kuo Hsia0
Jeng-Shien Hsieh0
Chen-Hua Yu0
Chuei-Tang Wang0
Date of Patent
December 25, 2018
0Patent Application Number
156609720
Date Filed
July 27, 2017
0Patent Citations Received
...
Patent Primary Examiner
0
Patent abstract
Semiconductor packages are provided. The semiconductor package includes a package substrate, a photonic integrated circuit, a laser die, an electronic integrated circuit, and a first redistribution structure. The package substrate includes connectors. The photonic integrated circuit is disposed over the package substrate. The laser die is optically coupled to the photonic integrated circuit. The electronic integrated circuit is disposed over the package substrate. The first redistribution structure is disposed over the package substrate, wherein the electronic integrated circuit is electrically connected to the photonic integrated circuit through the first redistribution structure.
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