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US Patent 10163691 Low-K dielectric interconnect systems
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Patent
Date Filed
September 18, 2017
Date of Patent
December 25, 2018
Patent Application Number
15707657
Patent Citations Received
US Patent 12125748 Contact plug
0
US Patent 12014987 Electro-migration reduction
0
US Patent 10978337 Aluminum-containing layers and methods of forming the same
US Patent 11036911 Charging prevention method and structure
US Patent 11251118 Self-aligned via structures with barrier layers
US Patent 11257926 Self-aligned contact structures
US Patent 11631639 Method of fabricating self-aligned via structures
US Patent 11264326 Contact via formation
US Patent 11652149 Common rail contact
0
US Patent 11276637 Barrier-free interconnect structure and manufacturing method thereof
•••
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10163691
Patent Primary Examiner
Mamadou Diallo
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