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US Patent 10163701 Multi-stack package-on-package structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
October 30, 2017
Date of Patent
December 25, 2018
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent Application Number
15797453
Patent Citations Received
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US Patent 11469215 Chip package structure with molding layer and method for forming the same
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US Patent 10636757 Integrated circuit component package and method of fabricating the same
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US Patent 11600590 Semiconductor device and semiconductor package
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US Patent 11756931 Chip package structure with molding layer
Patent Inventor Names
Li-Hsien Huang
0
Tien-Chung Yang
0
Wei-Yu Chen
0
An-Jhih Su
0
Chi-Jung Lee
0
Hsien-Wei Chen
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10163701
Patent Primary Examiner
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Tu-Tu V Ho

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