US Patent 10163813 Chip package structure including redistribution structure and conductive shielding film

A chip package structure is provided. The chip package structure includes a redistribution structure including a dielectric structure and a grounding line in the dielectric structure. The grounding line includes a main portion and an end enlarged portion connected to the main portion and laterally accessible from the dielectric structure. The chip package structure includes a chip structure over the redistribution structure. The chip package structure includes a conductive shielding film disposed over the chip structure and a first sidewall of the end enlarged portion. The conductive shielding film is electrically connected to the grounding line. A thickness of the end enlarged portion increases from the main portion to the conductive shielding film.