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US Patent 10163866 Semiconductor device and method of manufacture

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
September 27, 2017
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Date of Patent
December 25, 2018
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Patent Application Number
15717432
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Patent Citations Received
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US Patent 11581280 WLCSP package with different solder volumes
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US Patent 11482497 Package structure including a first die and a second die and a bridge die and method of forming the package structure
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US Patent 11600590 Semiconductor device and semiconductor package
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US Patent 10636757 Integrated circuit component package and method of fabricating the same
Patent Inventor Names
Ying-Ju Chen
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An-Jhih Su
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Hsien-Wei Chen
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Jie Chen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10163866
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Patent Primary Examiner
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Elias M Ullah
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