US Patent 10165344 Headphone

A headphone is provided. The headphone includes a housing and an speaker. The housing includes a first layer structure, a first receiving space, a first output path, a first trench and a sound output side. The speaker is located in the first receiving space, wherein the speaker includes a first speaker orientation, and the first speaker orientation corresponds to the first output path. The first output path includes the first trench, which is located at the first layer structure, extends around the speaker, and is connected to the sound output side.