US Patent 10165351 Headphone

A headphone is provided. The headphone includes a housing, a first speaker and a second speaker. The housing includes a sound output side, a first layer structure, a first output path, a first trench, a first recess, and a second recess. The first speaker is disposed in the first recess, wherein the first speaker includes a first speaker orientation, and the first speaker orientation corresponds to the first output path. The second speaker is disposed in the second recess. The first output path includes the first trench, which is located at the first layer structure, that extends around the first speaker, and is connected to the sound output side.