US Patent 10165705 Partitioned cooling for electronic devices and systems
Patent 10165705 was granted and assigned to Intel on December, 2018 by the United States Patent and Trademark Office.
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Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone, wherein the first cooling zone provides cooling for the one or more components that include an active thermal element; and a first fan located in the first cooling zone, the first fan to produce airflow for cooling in the first cooling zone and a second fan located in the second cooling zone to produce airflow for the cooling in the second cooling zone.
US Patent 10165705 Partitioned cooling for electronic devices and systems
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