Patent attributes
An integrated sensor module includes one or more packaged light source semiconductor devices and one or more packaged light detector semiconductor devices mounted to a top surface of a substrate. A pre-molded cover structure includes a portion molded from an opaque molding compound and a further portion molded from a light transmissive molding compound. For each of the packaged light source and light detector semiconductor devices, the pre-molded cover structure includes a pre-molded cavity covered by a window formed of the light transmissive molding compound. The pre-molded cover structure is attached to the substrate such that each of the packaged light source and light detector semiconductor devices fits within a respective cavity, and such that a barrier formed of the opaque molding compound is positioned between each packaged light source semiconductor device and light detector semiconductor device. The module can also include additional sensors and/or electrodes for use by sensors.
