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US Patent 10169624 Tamper-proof electronic packages with two-phase dielectric fluid
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Patent
Date Filed
December 11, 2017
Date of Patent
January 1, 2019
Patent Application Number
15836958
Patent Citations Received
US Patent 11778781 Method and system for in-situ measuring of a heat transfer fluid in a device for immersion cooling and device for immersion cooling
US Patent 10531561 Enclosure-to-board interface with tamper-detect circuit(s)
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US Patent 10667389 Vented tamper-respondent assemblies
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US Patent 10685146 Overlapping, discrete tamper-respondent sensors
Patent Inventor Names
Levi A. Campbell
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Dustin W. Demetriou
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Milnes P. David
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Michael J. Ellsworth, Jr.
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Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10169624
Patent Primary Examiner
Dion R. Ferguson
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