Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 8, 2019
Patent Application Number
15186588
Date Filed
June 20, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
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