US Patent 10177102 Tamper-proof electronic packages with stressed glass component substrate(s)
Is a
Date Filed
December 5, 2017
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Date of Patent
January 8, 2019
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Patent Application Number
15831554
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Patent Inventor Names
William Santiago-Fernandez
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Kenneth P. Rodbell
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Michael A. Gaynes
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Silvio Dragone
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James A. Busby
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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