Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Moon Hee Yi0
Yong Ho Baek0
Tae Seong Kim0
Date of Patent
January 8, 2019
Patent Application Number
15807075
Date Filed
November 8, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A fan-out semiconductor package includes: a support member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the support member and the semiconductor chip; and a connection member disposed on the support member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The support member includes a glass plate and an insulating layer connected to the glass plate.
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