Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Huiwen Xu0
Wing Cheung Chong0
Qiming Li0
Fang Ou0
Lei Zhang0
Date of Patent
January 8, 2019
0Patent Application Number
150079590
Date Filed
January 27, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.
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