Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 8, 2019
Patent Application Number
15583224
Date Filed
May 1, 2017
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.
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