Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rajesh Katkar0
Ashok S. Prabhu0
Date of Patent
January 15, 2019
0Patent Application Number
153329910
Date Filed
October 24, 2016
0Patent Citations Received
0
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Patent Primary Examiner
Patent abstract
Apparatuses and methods relating generally to a microelectronic package for wafer-level chip scale packaging with fan-out are disclosed. In an apparatus, there is a substrate having an upper surface and a lower surface opposite the upper surface. A microelectronic device is coupled to the upper surface with the microelectronic device in a face-up orientation. Wire bond wires are coupled to and extending away from the upper surface. Posts of the microelectronic device extend away from a front face thereof. Conductive pads are formed in the substrate associated with the wire bond wires for electrical conductivity.
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