US Patent 10182514 Thermal interface material structures
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Patent abstract
In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer and a second thermal interface material layer. The second thermal interface material layer at least partially overlaps the first thermal interface material layer.
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Patent Jurisdiction
Patent Number
101825140
Date of Patent
January 15, 2019
0Patent Application Number
151931860
Date Filed
June 27, 2016
0Patent Citations Received
Patent Primary Examiner
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Is a
Patent Jurisdiction
Patent Number
101825140
Date of Patent
January 15, 2019
0Patent Application Number
151931860
Date Filed
June 27, 2016
0Patent Citations Received
Patent Primary Examiner
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Patent Citations Received
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Patent citations received
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US Patent 10182514 Thermal interface material structures
Infobox
Is a
Patent jurisdiction
Patent number
10182514
Date of patent
January 15, 2019
Patent application number
15193186
Date Filed
June 27, 2016
Patent primary examiner
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