US Patent 10186479 Semiconductor device, package, and vehicle
Patent 10186479 was granted and assigned to Panasonic on January, 2019 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device includes a metal plate capacitor that includes a heat-resistant metal plate and a capacitor unit including a sintered dielectric formed on at least one surface of the heat-resistant metal plate, a semiconductor chip disposed on the metal plate capacitor, a connector configured to electrically connect the semiconductor chip and the metal plate capacitor, and a protector configured to protect the semiconductor chip, the metal plate capacitor, and the connector.
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Patent Inventor Names
Hidenori Katsumura0
Hiroyoshi Yoshida0
Kazuhide Uriu0
Masaya Sumita0
Osamu Shibata0
Shinya Tokunaga0
Yasuhiro Sugaya0
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Patent Citations Received
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US Patent 10186479 Semiconductor device, package, and vehicle
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10186479
Date of patent
January 22, 2019
Patent application number
15426142
Date Filed
February 7, 2017
Patent primary examiner
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