A circuit structure includes a circuit board mounted with electronic components, a heat release member overlaid by the circuit board and releasing heat of the circuit board, a screw screwing the circuit board to the heat release member, and a spacer on which an insertion hole is formed to insert a shaft portion of the screw and the spacer is arranged between the circuit board and the screw to receive the screw. The spacer includes a board presser pressing the circuit board and a heat release member presser pressing the heat release member when the circuit board is screwed to the heat release member.