Patent 10194861 was granted and assigned to Nitto Denko on February, 2019 by the United States Patent and Trademark Office.
A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.