US Patent 10199247 Directed self-assembly of electronic components using diamagnetic levitation
Patent 10199247 was granted and assigned to Rensselaer Polytechnic Institute on February, 2019 by the United States Patent and Trademark Office.
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Patent abstract
Embodiments of the invention relate generally to directed self-assembly (DSA) and, more particularly, to the DSA of electronic components using diamagnetic levitation.
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Patent Inventor Names
Anton Tkachenko0
James Jian-qiang Lu0
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Patent Applicant
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Patent Jurisdiction
Patent Number
101992470
Date of Patent
February 5, 2019
0Patent Application Number
155191900
Date Filed
October 16, 2015
0Patent Citations Received
Patent Primary Examiner
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US Patent 10199247 Directed self-assembly of electronic components using diamagnetic levitation
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10199247
Date of patent
February 5, 2019
Patent application number
15519190
Date Filed
October 16, 2015
Patent primary examiner
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