Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 10204889 Package structure and method of forming thereof
Overview
Structured Data
Issues
Contributors
Activity
Access by API
Access by API
Is a
Patent
0
Date Filed
January 18, 2017
0
Date of Patent
February 12, 2019
0
Patent Application Number
15409385
0
Patent Citations Received
US Patent 11545422 Fan-out semiconductor package including under-bump metallurgy
0
US Patent 10930525 Carrier substrate and method of manufacturing semiconductor package using the carrier substrate
Patent Inventor Names
Po-Hao Tsai
0
Jing-Cheng Lin
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10204889
0
Patent Primary Examiner
Eugene Lee
0
Find more entities like US Patent 10204889 Package structure and method of forming thereof
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
SUBSCRIBE