Patent attributes
Certain aspects of the present disclosure generally relate to a semiconductor device. The semiconductor device generally includes a substrate, a channel disposed above the substrate, and a first dielectric layer disposed adjacent to a first side of the channel. The semiconductor device may also include a first non-insulative region disposed between the first dielectric layer and the substrate, and a second dielectric layer disposed adjacent to a second side of the channel, wherein the first dielectric layer and the second dielectric layer comprise high-k layers. In certain aspects, a second non-insulative region may be disposed above the second dielectric layer, and a third non-insulative region may be disposed adjacent to a third side of the channel.
