US Patent 10205125 Method of manufacturing package assembly, package assembly, and display device

This invention discloses a method of manufacturing a package assembly, a package assembly, and a display device. The method includes: providing a base substrate, provided with a first pattern layer and a second pattern layer located outside the first pattern layer; forming a first cladding layer on the base substrate, the first cladding layer covering a second pattern layer and a region surrounded by the second pattern layer; forming a second cladding layer on the first cladding layer, the second cladding layer covering a top portion of the first pattern layer and a region surrounded by the first pattern layer; forming an organic layer on the first cladding layer and the second cladding layer, the organic layer covering the first pattern layer and a region surrounded by the first pattern layer; and forming a third cladding layer on the organic layer and the first cladding layer.