Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chung Hsiung Ho0
Wen-Hsuan Lin0
Date of Patent
February 19, 2019
Patent Application Number
15011198
Date Filed
January 29, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
Embodiments of a method for packaging Integrated Circuit (IC) dies and an IC device are described. In an embodiment, a method for packaging IC dies involves creating openings on a substrate, where side surfaces of the openings on the substrate are covered by metal layers, placing the IC dies into the openings on the substrate, applying a second metal layer to the substrate, where the IC dies are electrically connected to at least a portion of the second metal layer, and cutting the substrate into IC devices.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
