Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nathan A. Nuttall0
Date of Patent
February 19, 2019
0Patent Application Number
158261650
Date Filed
November 29, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.
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