US Patent 10214612 Epoxy resin composition comprising 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine as hardener

An epoxy resin composition including A) at least one epoxy compound, and B) a hardener composition including B1) from 0.1%-100% by weight of 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine, and B2) from 99.9%-0% by weight of at least one further diamine and/or polyamine, where the stoichiometric ratio of the epoxy groups of A) and the number of active hydrogen atoms of the functional groups of B) varies from 1:2 to 2:1.