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US Patent 10217637 Chip handling and electronic component integration

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 20, 2017
Date of Patent
February 26, 2019
Patent Application Number
15709876
Patent Citations Received
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US Patent 11942354 Dynamic release tapes for assembly of discrete components
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US Patent 10658182 Chip handling and electronic component integration
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US Patent 10797009 Method for transferring micro device
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US Patent 11241839 Integrating 3D printing into multi-process fabrication schemes
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US Patent 10968348 Laser-releasable bonding materials for 3-D IC applications
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US Patent 11009798 Wafer alignment markers, systems, and related methods
0
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US Patent 11251096 Wafer registration and overlay measurement systems and related methods
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US Patent 11289360 Methods and apparatus for protection of dielectric films during microelectronic component processing
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US Patent 11749668 PSPI-based patterning method for RDL
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US Patent 11342302 Bonding with pre-deoxide process and apparatus for performing the same
0
•••
Patent Inventor Names
Jeffrey D. Gelorme
0
Qianwen Chen
0
Russell A. Budd
0
Bing Dang
0
John U. Knickerbocker
0
Li-wen Hung
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10217637
Patent Primary Examiner
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Errol Fernandes

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