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US Patent 10217728 Semiconductor package and semiconductor process

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
November 22, 2016
Date of Patent
February 26, 2019
Patent Application Number
15359403
Patent Citations Received
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US Patent 11942385 Semiconductor package structure
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US Patent 10777536 Semiconductor package with air cavity
0
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US Patent 11569196 Chip to chip interconnect in encapsulant of molded semiconductor package
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US Patent 10916524 Stacked dice systems
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US Patent 11587800 Semiconductor package with lead tip inspection feature
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US Patent 11289436 Semiconductor package having a laser-activatable mold compound
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US Patent 11296000 Formation of conductive connection tracks in package mold body using electroless plating
Patent Inventor Names
You-Lung Yen
0
Bernd Karl Appelt
0
Kay Stefan Essig
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10217728
Patent Primary Examiner
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S. V. Clark

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