US Patent 10222566 Optoelectronic package with pluggable fiber assembly

A photonic integrated circuit (PIC) coupled to a substrate may be aligned with receptacles having guide pin structures configured to receive guide pins attached to a fiber assembly. The receptacles may be affixed to a surface of the substrate and/or the PIC to permit the fiber assembly to be removed during a solder reflow process while maintaining the alignment of the fiber assembly to the PIC when reconnected following the solder reflow process.