Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jen-Kuang Fang0
Wen-Long Lu0
Date of Patent
March 5, 2019
0Patent Application Number
156420050
Date Filed
July 5, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package device includes a carrier, a first electronic component, and a conductive element on the carrier. The first electronic component is over the carrier. The conductive element is on the carrier and electrically connects the first electronic component to the carrier. The conductive element includes at least one conductive particle and a solder material covering the conductive particle, and the conductive particle includes a metal core, a barrier layer covering the metal core, and a metal layer covering the barrier layer.
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