US Patent 10224392 Method of fabricating a semiconductor capacitor

A method of fabricating a semiconductor capacitor is disclosed. The method includes forming a first trench in a semiconductor substrate, forming a dielectric lining layer in the first trench, and depositing a first capacitor conductor plate layer on the dielectric lining layer. The method also includes forming a second trench such that the dielectric lining layer is exposed. The method also includes forming a third trench such that the dielectric lining layer is exposed within the third trench. The method also includes depositing a second capacitor conductor plate layer in the second trench and depositing a third capacitor conductor plate layer in the third trench. The method also includes forming a first electrical contact between the first capacitor conductor plate layer and the second capacitor conductor plate layer and forming a second electrical contact between the first capacitor conductor plate layer and the third capacitor conductor plate layer.