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US Patent 10232470 Temporal pulse shaping for laser shock peening

Patent 10232470 was granted and assigned to LSP Technologies, Inc. on March, 2019 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11955763 Method and apparatus for use in laser shock peening
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US Patent 11858065 Method and system for use in laser shock peening and laser bond inspection process
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Patent abstract

Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier.

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US Patent 11638970 Enhanced material shock using spatiotemporal laser pulse formatting
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US Patent 10819079 Method and apparatus for use in laser shock peening
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 US Patent 10232470 Temporal pulse shaping for laser shock peening

Infobox
Is a
Patent
Patent
Patent applicant
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LSP Technologies, Inc.
Current assignee
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LSP Technologies, Inc.
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10232470
Date of patent
March 19, 2019
Patent application number
15659680
Date Filed
July 26, 2017
Patent primary examiner
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Samuel M. Heinrich

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