US Patent 10236224 Apparatus and method for reducing wafer warpage
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Patent abstract
An apparatus and a method for reducing wafer warpage are provided. The method includes positioning a mold wafer structure on a stage. The mold wafer structure includes a mold layer and a stack structure positioned on a wafer. The stage includes a center region and an edge region adjacent the center region. Warpage information of the mold wafer structure is obtained. The mold wafer structure is heated by the stage based on the warpage information to reduce a warpage of the mold wafer structure. A temperature of the center region and a temperature of the edge region are different from each other. An operation test is performed on the stack structure.
Edits on 3 Apr, 2023
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Patent Jurisdiction
Patent Number
102362240
Date of Patent
March 19, 2019
0Patent Application Number
154673420
Date Filed
March 23, 2017
0Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
102362240
Date of Patent
March 19, 2019
0Patent Application Number
154673420
Date Filed
March 23, 2017
0Patent Primary Examiner
Edits on 25 Jan, 2022
Golden AI
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US Patent 10236224 Apparatus and method for reducing wafer warpage
Infobox
Is a
Patent jurisdiction
Patent number
10236224
Date of patent
March 19, 2019
Patent application number
15467342
Date Filed
March 23, 2017
Patent primary examiner
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