Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 19, 2019
Patent Application Number
15640071
Date Filed
June 30, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.
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