US Patent 10242799 Polymerization method for preparing conductive polymer
Patent 10242799 was granted and assigned to Kemet Electronics Corporation on March, 2019 by the United States Patent and Trademark Office.
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Patent abstract
An improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
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Patent Inventor Names
Antony P. Chacko0
John Ols0
Yaru Shi0
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US Patent 10242799 Polymerization method for preparing conductive polymer
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10242799
Date of patent
March 26, 2019
Patent application number
15623728
Date Filed
June 15, 2017
Patent primary examiner
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