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US Patent 10242957 Compartment shielding in flip-chip (FC) module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 27, 2015
Date of Patent
March 26, 2019
Patent Application Number
14633934
Patent Citations Received
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US Patent 12127335 Electronic device
0
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US Patent 10396040 Method for fabricating electronic package having a protruding barrier frame
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US Patent 10504827 Semiconductor device and manufacturing method thereof
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US Patent 11562980 Wafer-level package structure
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US Patent 10861822 Wafer-level packaging method and package structure thereof
0
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US Patent 10978421 Wafer-level packaging method and package structure
0
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US Patent 11444013 Semiconductor device and manufacturing method thereof
Patent Inventor Names
Jonghae Kim
0
Changhan Hobie Yun
0
Chengjie Zuo
0
Daeik Daniel Kim
0
Matthew Michael Nowak
0
Mario Francisco Velez
0
David Francis Berdy
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10242957
Patent Primary Examiner
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Joseph Schoenholtz

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