Patent attributes
An apparatus that includes: a printed circuit board (PCB) that includes: a multilayer lamination of one or more ground layers, one or more power layers, and multiple signal layers; multiple vias that pass through one or more layers of the multilayer lamination, wherein a first via of the multiple vias includes: a first portion that has a first diameter, and a second portion that has a second diameter that is smaller than the first diameter, wherein a second via of the multiple vias includes: a third portion that has a third diameter, and a fourth portion that has a fourth diameter that is smaller from the third diameter; and wherein the first portion of the first via is adjacent to the fourth portion of the second via and the second portion of the first via is adjacent to the third portion of the second via is disclosed.
